A Generation Ahead 28nm Process Technology

Xilinx and technology and manufacturing partner Taiwan Semiconductor Manufacturing Company (TSMC) developed a high-κ metal gate (HKMG), high-performance, low-power 28nm process technology for FPGAs. This new 28nm process technology builds upon the achievements of 40nm FPGA process development and introduces a new HKMG technology to maximize usable system performance through lower power.

Our technology, although unique in the FPGA industry, is already being embraced by other leading-edge IC suppliers because it dramatically reduces static power when compared with alternative process technologies. At the 28nm node, static power is often a more significant portion of the total power dissipation of a device. Therefore, to achieve maximum power efficiency, the choice of process technology is paramount.

Dramatic reductions in FPGA static power at 28nm leaves more of the system power budget for active, dynamic power, yielding higher levels of both integration and system performance. This gives designers the flexibility to implement products at lower power, or alternatively, create products that increase capacity and performance within the same power budget.

Breakthrough in Optimization and Integration

Five product families with breakthroughs in integration and optimization that change the game in price/performance/watt and enable programmable systems integration. With a broad portfolio of All Programmable FPGAs, SoCs and 3D ICs, you are empowered to maximize system performance, lower power, and reduce BOM costs, while preserving design flexibility across a wide range of markets and applications.

Setting a new industry standard for programmable systems integration

• Logic Integration - at 2M logic cells, 85 Mb RAM, 3600 DSP48E slices, the 7 series delivers unchallenged industry leadership in logic, memory, and DSP capacity
• SerDes Integration - unmatched total SerDes count, bandwidth, and channel optimization enable the industry’s leading integrated systems with the highest performance and signal integrity
• Analog Mixed Signal - on chip integration of digitally customizable AMS eliminates multiple devices yielding unmatched BOM savings, system reliability, and security
• Embedded Processing - on chip integration of an industry-standard ARM® dual-core Cortex™-A9 MPCore™ processing sub-system delivers breakthrough, All Programmable SoC capabilities

Devices optimized for critical market needs, from the highest performance to the most cost-sensitive

• Extreme Bandwidth and Capacity - the industry’s new watermark for bandwidth and capacity leadership; 2.7Tb/s serial bandwidth, 5T MAC/s, and 2M logic cells
• Performance - greater than 2X system performance vs. previous generations, and up to 40% average performance advantage vs. equivalent competitive product families
• Price/Performance/Watt - optimized features and performance leveraging TSMC’s 28HPL process to deliver game changing value that is unmatched in the industry
• Price and Power - combining process technology, design techniques, and architectural enhancements to deliver the lowest in-class power consumption and price

Staying a Generation Ahead: 20nm Portfolio

Xilinx’s 20nm portfolio, which includes the next-generation 8 series All Programmable FPGAs and 2ndgeneration of 3D ICs and SoCs, builds upon the breakthroughs that were proven at 28nm to provide an extra generation of system performance, lower power and programmable system integration.  Co-optimized with Xilinx’s Vivado Design Suite for the highest productivity and quality of results, the 20nm portfolio will address a wide range of next generation systems and provide the most compelling programmable alternative ever to ASICs and ASSPs.

Source:http://www.xilinx.com/about/all-programmable-leadership/index.htm